Zenith Railway Academy, in collaboration with IIT Delhi’s Department of Electrical Engineering and DRIIV (under the Office of the Principal Scientific Adviser to the Government of India), presents an Executive Program in ESDM & Semiconductor Technologies — a unique opportunity to gain industry-ready skills and a prestigious certification.
Key Highlights of the Program:
• Certification from IIT Delhi & PM-STIAC
• Weekend Live Online Classes – Designed for working professionals
• 2-Day Immersion Bootcamp at IIT Delhi
• Learn from India’s top semiconductor experts & faculty
• Hands-on sessions with PCB Design, Embedded Systems, Testing Tools & More
• Real-world case studies and projects
• Be job-ready for high-demand roles like Semiconductor Design Engineer, IoT Solutions Engineer, Embedded Systems Specialist, and more

Starts: May 2025
Mode: Blended (Live Zoom + Campus Bootcamp)
Fee: ₹1,00,000 + GST (Easy EMI options available)
Eligibility: B.E./B.Tech./M.Tech. in ECE/EEE/VLSI/Embedded Systems or related fields
Course Curriculum:

Module 1: Basics of ESDM (3 Hours)
Session 1: Basics of Semiconductors & Electronics
Introduction to electronic components, circuits, and semiconductor materials.
Learning Outcome: Students will be able to explain the fundamental principles of semiconductors, circuit techniques, and materials used in electronics.

Module 2: Electronic System Level Design, Modeling & Prototyping (6 Hours)
Session 2: Electronic System Level Modeling & Design
Overview of system-level modeling and electronic design.
Learning Outcome: Students will understand how to model electronic systems and simulate their performance.
Session 3: Prototyping & Product Testing
Hands-on session on prototyping techniques, drafting schematics, and testing.
Learning Outcome: Students will be able to create schematic diagrams and test electronic prototypes effectively.

Module 3: Semiconductor CMOS Technology (4 Hours)
Session 4: Semiconductor Fundamentals
Crystal growth, wafer processing, and CMOS process structures.
Learning Outcome: Students will be able to describe semiconductor crystal growth, wafer processing, and CMOS structures.

Module 4: Semiconductor Manufacturing (8 Hours)
Session 5: Clean Room & Wafer Processing
Understanding clean room requirements, wafer cleaning, and chip yield modeling.
Learning Outcome: Students will be able to explain semiconductor cleanroom environments, wafer cleaning techniques, and yield modeling.
Session 6: Contamination & Photo-Resists
Deep dive into contamination control, photoresist application, and lithography techniques.
Learning Outcome: Students will be able to identify contamination risks and explain the role of photoresists in the semiconductor manufacturing process.
Session 7: Doping Techniques
Understanding semiconductor doping processes, such as ion implantation and diffusion.
Learning Outcome: Students will be able to describe doping methods and their effects on semiconductor properties.

Module 5: Advanced Fabrication Technologies (6 Hours)
Session 8: Deposition & Sputtering Techniques
Chemical Vapor Deposition (CVD)
Chemical Vapor Deposition (CVD), Sputtering, and Molecular Beam Epitaxy (MBE).
Learning Outcome: Students will be able to compare various deposition techniques used in semiconductor fabrication.
Session 9: Interconnect Processing
Study of interconnect processing technologies for semiconductor chips.
Learning Outcome: Students will understand the formation of interconnects and their impact on chip performance.

Module 6: Advanced Packaging Topics (6 Hours)
Session 10: Thermal Management in Packaging
Heat dissipation techniques and packaging solutions.
Learning Outcome: Students will be able to explain thermal management techniques for semiconductor packaging.
Session 11: 3D Device Stacking & Bonding Techniques
Introduction to 3D stacking, wafer-to-wafer (W2W), and die-to-wafer (D2W) bonding.
Learning Outcome: Students will describe 3D stacking and bonding technologies in semiconductor packaging.

Module 7: Critical System-Level Issues (6 Hours)
Session 12: Signal Integrity & EMI/EMC Basics
Introduction to signal integrity, EMI/EMC testing, and power integrity.
Learning Outcome: Students will be able to analyze EMI/EMC issues and apply basic signal integrity principles.
Session 13: ESD Protection & System Testing
Understanding Electrostatic Discharge (ESD) Protection and System-Level Reliability Testing
Learning Outcome: Students will be able to apply ESD protection techniques and understand testing methodologies.
Practical Sessions (24 Hours)
Session 14-16: PCB Design Using Altium (10 Hours)
Hands-on PCB design, manufacturing techniques, and soldering process.
Learning Outcome: Students will design and simulate PCBs using Altium software.
Sessions 17-18: Electronics Measurement & Testing (6 Hours)
Training on test benches, testing equipment, and troubleshooting methods.
Learning Outcome: Students will utilize testing equipment to measure and analyze the behavior of circuits.
Sessions 19-21: Board-Level Testing & Fault Diagnosis (8 Hours)
Techniques for troubleshooting, identifying faults, and improving board performance.
Learning Outcome: Students will be able to perform board-level testing and diagnose electronic faults efficiently.

The assessment strategy for this course will evaluate students’ theoretical knowledge, practical skills, and problem-solving abilities using a combination of quizzes, assignments, hands-on projects, and a final assessment.

For further details or to register, please email jayatu@railwayacademy.org or contact us at +91 7980846563.

Looking forward to your participation!